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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, by John H. Lau
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One-stop, cutting-edge guide to flip chip technologies. Now you can turn to a single, all-encompassing reference for a practical understanding of the fast-developing field that's taking the electronics industry by storm. Low-Cost Flip Chip Technologies, by John H. Lau, brings you up to speed on the economic, design, materials, process,equipment, quality, manufacturing, and reliability issues related to low cost flip chip technologies. This eye-opening overview tells you what you need to know about applying flip chip technologies to direct chip attach(DCA), flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. You'll discover flip chip problem-solving methods, and learn how to choose a cost-effective design and reliable, high-yield manufacturing process for your interconnect systems as you explore...
*IC trends and packaging technology updates
*Over 12 different wafer-bumping methods...more than 100 lead-free solder alloys
*Sequential build up PCB with microvias and via-in-pad
*How to select underfill materials
*And much, much more!
- Sales Rank: #298184 in Books
- Published on: 2000-02-08
- Ingredients: Example Ingredients
- Original language: English
- Number of items: 1
- Dimensions: 8.80" h x 1.80" w x 6.10" l,
- Binding: Hardcover
- 585 pages
From the Back Cover
The first comprehensive and in-depth guide to low cost flip chip technologies, this reference gives you cutting edge information on the most important new developments and latest research results in applying flip chip technologies to direct chip attach (DCA), e.g., flip chip on board (FCOB), wafer level chip scale package (WLCSP), and plastic ball grid array (PBGA) package assemblies. For professionals active in flip chip research and development, those who wish to master flip chip problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in all aspects of this fascinating field. This one-stop guide meets the reference needs of engineers in the fields of design, materials, process, equipment, manufacturing, quality control, product assurance, reliability, component, packaging, marketing, and systems design, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the economic, design, materials, process, equipment, quality, manufacturing, and reliability of issues of low cost flip chip technologies. Among the topics explored: IC trends and packaging technology updates; more than 12 different wafer-bumping methods; more than 100 lead-free solder alloys; sequential build up PCB with microvias and via-in-pad; FCOB with anisotropic conductive film (ACF); FCOB with anisotropic conductive adhesive (ACA); solder-bumped FCOB with conventional underfills; how to select underfill materials; thermal management of solder-bumped FCOB; reliability of solder-bumped FCOB; failure analysis of solder-bumped FCOB; design, materials, process, and reliability of WLCSPs; solder-bumped flip chip in PBGA packages; fracture mechanics analysis of delaminations; creep analysis of solder joints. Low cost flip chip technology is taking the electronics industry by storm. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use Low Cost Flip Chip Technologies: For DCA, WLCSP, and PBGA Assemblies, you'll see why it's the resource of choice for those who want to be at the top of the game.
About the Author
John H. Lau is President of Express Packaging Systems of Palo Alto, California, the author of 8 books on electronic packaging, and an internationally recognized expert in the field. A former senior engineer at Hewlett-Packard Company, he has more than 25 years of research and development experience in applying the principles of engineering and science to the electronic, petroleum, nuclear, and defense industries. He has authored and co-authored over 100 technical publications in these areas and is the author and editor of the books Solder Joint Reliability: Theory and Applications; Handbook of Tape Automated Bonding; Thermal Stress and Strain in Microelectronics Packaging; Handbook of Fine Pitch Surface Mount Technology; The Mechanics of Solder Alloys Interconnects; Chip On Board Technologies for Multichip Modules; and Ball Grid Array Technology.
Most helpful customer reviews
4 of 4 people found the following review helpful.
An excellent book for R/D engineers and graduate students.
By Enboa Wu
I found this book an excellent one for engineers in research and development department, such as the packaging R/D team I am associated with. For an R/D engineer, this is a perfect reference book to get a brief idea about relevant technologies in every aspect of flip chip packages and the advantage/drawback of one technology over others. This is important as for most of the development teams wafer level packages and flip chip technologies are still under development or in the trial run stage. Further, as cost is always the primary concern for essentially all the packages, including, of course, flip chip packages, this book does offer a lot of kits and alternatives for R/D engineers to choose which material and process technology should be the most suitable for them to develop. This book also offers many types of new flip chip and wafer level packages, along with abundant up-to-date references in each chapters, that can stimulate a good engineer and trigger new ideas for either new improvement or inventing new packages for their specific applications.
On the other hand, it is also a very suitable reference book for a packaging class in the graduate school level. For students with material or chemistry/chemical engineering background, they can very much understand two-thirds of the contents. As to students with mechanical or electrical engineering background, with instructor's guidance, they can also grasp this part of knowledge with reasonable effort. For the rest one-third of contents that involves the use of the theory of fracture mechanics and finite element methods, most students should also be able to understand the spirit without much difficulty through the instructor's explanation.
Enboa Wu, Director for Electronic Packaging Technology Division, ERSO/ITRI, Taiwan; and Professor of Institute of Applied Mechanics, National Taiwan University.
3 of 3 people found the following review helpful.
Low Cost Flip Chip Technologies
By Yi Hsin Pao
As the electronics industry is being driven by market demand to produce multi-functional, high-performance, miniature, and light-weight products, flip chip technology has been identified a key enabler, as well as a core technology for future electronics products. Although there have been numerous studies on this subject, they are scattered in different sources of literature and thus make it difficult for any one who would like to obtain a general, systematic, and comprehensive understanding of this technology.
This book comes just in time to fulfill the need and, in my opinion, is a best-in-class in the area of flip chip technologies for organic boards. Its 16 chapters cover a full spectrum from theory to application and provide scientists and engineers with an excellent, most up-to-date reference in flip chip technologies.
The book discusses major applications of flip chip technologies in direct chip attachment, wafer level CSP and plastic BGA, together with numerous examples of packages either being widely used in industries or emerging as a trend in the future. Each technology is discussed in detail from various aspects, such as design, PCB requirements, manufacturing, material, thermal management, failure analysis, and reliability, along with comprehensive references of literature. In fact, most of them represent previous work done by the author, who is not only a leading expert in electronic packaging industry but an active author of more than 10 books in the area of electronic packaging.
I found this book extremely useful to my research in electronic packaging technologies and thus highly recommend to whomever might need to understand and apply this technology to their work or studies.
Yi-Hsin Pao, Ph.D. Manager, Materials Engineering Dept. Visteon Automotive Systems Ford Motor Company
2 of 2 people found the following review helpful.
Excellent book both for students and packaging professional
By K.L. Jim
The book exceeded all my expectations as a comprehensive discourse on Flip Chip technologies. It is extremely difficult to write a book that caters equally well to students and professionals alike, but the author seems to have succeeded in the task. For professionals in the field of electronic packaging, the book is an invaluable and comprehensive resource whether to refer a quick topic, or to study a concept in detail. It is also very up-to-date, complete with current international papers. For students, the fluid style makes good reading and the important concepts are explained thoroughly. Finally, the informations are very useful, and sometimes even lead to contemporary research issues.
As someone who was in the industry, and currently working at the University of Oxford - I can say that the book works great for both. Altogether, an excellent and timely book for electronic packaging people!
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