PDF Ebook Electronic Packaging and Interconnection Handbook, by Charles A. Harper
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Electronic Packaging and Interconnection Handbook, by Charles A. Harper
PDF Ebook Electronic Packaging and Interconnection Handbook, by Charles A. Harper
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Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook,Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package.
Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.
- Sales Rank: #1178384 in Books
- Published on: 2000-02-18
- Original language: English
- Number of items: 1
- Dimensions: 9.30" h x 2.40" w x 6.30" l,
- Binding: Hardcover
- 992 pages
Review
Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. (Sci-Tech Book News 20041201)
From the Back Cover
Electronic Packaging & Interconnection Handbook Widely regarded as the definitive resource in the field, Electronic Packaging & Interconnection Handbook, now in a thoroughly revised Second Edition, features over 50% all-new information, plus updated material on other major developments in high-performance packaging. Here is the latest practical insight into such vital new areas as advanced single and multichip packaging, ball grid array, flip chip packaging, chip scale packaging, and packaging microwave, high-speed and high-voltage electronics, in addition to cutting-edge analysis of advances in surface mount and soldering technologies. Distinguised specialists come together to cover all the fundamentals-from design to testing-as well as all connector and interconnection technologies and all types of electronics systems, providing-for the first time in any book-and integrated set of data and guidelines for packagers to use. Relying on the Handbook, practitioners will be better able to: optimize the mechanical and thermal design of electronic packages; Select the highest-yield, lowest-cost manufacturing processes, materials, and controls; Develop new markets for existing products; Create new products for emerging electronics systems. Featuring more than 600 illustrations, the Second Edition of this benchmark tool will be indispensible in assuring the development of more reliable, more manufacturable, and more cost-effective electronic packages and, finally, systems.
About the Author
Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronocs industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
Most helpful customer reviews
19 of 20 people found the following review helpful.
Not A Must Own, But A Good Book
By D. Fish
Today, product performance requirements and environmental concerns force designers and productassemblers to become more aware and involved in electronic packaging and interconnect decisions than ever before. Product performance requirements spiral from the effects of increasing operating speed, decreasing package size, lowering cost, and reducing time to market. These spiraling requirements decrease the emphasis on traditional component packaging, raise new component packaging and handling issues, and place more responsibility for packaging on the assembler, all the while increasing component and product complexity. Environmental concerns drive new requirements for cleaning, interconnection, and reclaiming and conserving resources; and political responses to issues, previously beyond the scope of influence on engineers and scientists.
Maybe addressing all of those issues is too much to expect of one book, but Charles Harper comes close in the latest (3rd) edition of Electronic Packaging and Interconnection Handbook. While many books have a narrower focus, few books in electronics cover the breadth of topics in Harper's Handbook. Major sections are: Fundamental Technologies, Interconnection Technology, and System Packaging Technology. The section on Fundamental Technologies has chapters on Materials For Electronic Packaging, Thermal Management, Thermal And Mechanical Stress Behavior In Electronic Packaging, Connectors And Interconnection Technology, Wiring And Cabling, and Solder Technologies For Electronic Packaging And Assembly. The next section, Interconnection Technology, includes chapters on Packaging And Interconnection Of Integrated Circuit Packaging, Surface Mount Technologies, Hybrid Microelectronics And Multichip Modules, Chip Scale Packaging And Direct Chip Attach Technologies, and Rigid And Flexible Printed Wiring Boards
Mr. Harper wrote this book to aid in the practice of implementing electronic designs into products. In Harper's multi-disciplined approach to describing electronic packing and interconnect, he calls on 19 recognized specialists from industry and academia to make sense of this complicated, interdisciplinary field. It is a unique collection of key data, facts, practical guidance, and circuit and package design basics. The book covers the practice of electronics packaging from the fundamentals to new technologies. It can be read, understood, and used by design, quality, and manufacturing engineers to build a foundation of practical knowledge of topics and without a need for complex analysis. It's a good starting point to learn about an unfamiliar topic, because the book provides information on wide range of topics that are just beyond the range of the familiar areas of one's day-to-activities, regardless of one's field of endeavor.
Another point of comparison is another handbook. From a breadth of coverage, clarity of purpose, discipline, and execution; Juran's Quality Control Handbook has to be the bench mark for evaluating for all other handbooks. From that perspective, Harper falls short. Admittedly, Juran has a thirty year and two edition head-start, but it is better organized and written, tightly edited, and has overcome Harper's single biggest shortcoming, an index of limited utility.
The Electronic Packaging and Interconnection Handbook is a good book, covering a broad range of topics that will fill-in the gaps of knowledge between other books on your book shelf.
2 of 7 people found the following review helpful.
A Professional writes a professional book
By Wang Chuansheng
I know Mr. Harper is well-known in electronic packaging field. His presentations have been read and studied in China. I think this book must be a best-seller in electronic packaging world. I wish I could buy one if it is possible in China.
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